hisense A9 Pro против hotwav T7S

Кратко

Бренд: HiSense; Hotwav
Дата выхода: март 2023 г., 3 лет 3 месяцев назад; январь 2025 г., 1 лет 5 месяцев назад
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Диагональ: 6.1"; 6.52"
Разрешение: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Тип: eInk E INK Carta 1200; LCD IPS
Плотность пикселей: 302 ppi High Density; 407 ppi Very high density
Соотношение сторон: 18:9; 21:9
Особенности: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Процессор: Qualcomm Snapdragon 662; MediaTek MT8788V
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Тип ядер: Octa-Core; Octa-Core
Техпроцесс: 11 nm; 12 nm
Частота: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Mali-G72 MP3
Оперативная память: 8 GB; 4 GB
64-бит: Yes; Yes
Тип ОЗУ: —; LPDDR4X RAM

Разрешение: 13 Mpx; 21 Mpx
Диафрагма: Unknow; Unknow
Вспышка: LED; LED
Оптическая стабилизация: No; No
Замедленная съёмка: No, 30 fps; No, 30 fps
Особенности: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Сенсор: —; Sony Exmor

Ёмкость: 256 GB; 128 GB
Слот SD-карты: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Тип: —; eMMC 5.1 Storage

Размеры: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Вес: 183 g; 310 g
Материалы: Plastic; Rugged Smartphone, Plastic , Faux leather
Цвета: Black; Black Green
Полезная площадь: 76 %; 71 %
Защита от воды и пыли: —; IP68, IP69 , MIL-STD-810H
Защита от падений: —; Class A B C D E 270 drops without defects
Ремонтопригодность: —; Class A B C D E

Операционная система: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Сервисы Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Профили Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Возможности Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Возможности USB: Charging, OTG; Charging, OTG
Навигация: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)