hisense A9 Pro против Xiaomi Redmi 13X

Кратко

Бренд: HiSense; Xiaomi
Дата выхода: март 2023 г., 3 лет 3 месяцев назад; март 2025 г., 1 лет 3 месяцев назад
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Диагональ: 6.1"; 6.79"
Разрешение: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Тип: eInk E INK Carta 1200; LTPS LCD
Плотность пикселей: 302 ppi High Density; 388 ppi High Density
Соотношение сторон: 18:9; 19.5:9
Особенности: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Max brightness HBM - 550 cd/m², Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Процессор: Qualcomm Snapdragon 662; MediaTek Helio G91
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Тип ядер: Octa-Core; Octa-Core
Техпроцесс: 11 nm; 12 nm
Частота: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G52 MC2 850MHz
Оперативная память: 8 GB; 6 GB
64-бит: Yes; Yes

Разрешение: 13 Mpx; 108 Mpx
Диафрагма: Unknow; ƒ/ 1.8
Вспышка: LED; Quad LED
Оптическая стабилизация: No; No
Замедленная съёмка: No, 30 fps; Yes, 120 fps
Особенности: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Ёмкость: 256 GB; 128 GB
Слот SD-карты: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Тип: —; eMMC 5.1 Storage

Размеры: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.3 mm Print 3D Model
Вес: 183 g; 205 g
Материалы: Plastic; Plastic , P2i Nano coating , Splash resistant design
Цвета: Black; Black Cyan
Полезная площадь: 76 %; 94 %

Операционная система: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Сервисы Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3 LELow energy consumption
Профили Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Возможности Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Возможности USB: Charging, OTG; Charging, OTG
Навигация: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)